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? 2002-2012 microchip technology inc. ds21380c-page 1 tc1269 features ? very low ground current for longer battery life ? very low dropout voltage ? 300ma output circuit ? high output voltage accuracy ? standard or custom output voltages ? power saving shutdown mode ? bypass input for ultra quiet operation ? over current and over temperature protection ? space-saving msop package applications ? battery operated systems ? portable computers ? medical instruments ? instrumentation ? cellular/gsm/phs phones ? linear post-regulator for smps ? pagers ?digital cameras device selection table *other output voltages are available. please contact microchip technology inc. for details. package type general description the tc1269 is a fixed output, high accuracy (typically 0.5%) cmos upgrade for older (bipolar) low dropout regulators. total supply current is typically 50 ? a at full load (20 to 60 times lower than in bipolar regulators). tc1269 key features include ultra low noise operation (plus optional bypass input); very low dropout voltage (typically 240mv at full load), and fast response to step changes in load. supply current is reduced to 0.05 ? a (typical) and v out falls to zero when the shutdown input is low. the tc1269 incorporates both over temperature and over current protection. the tc1269 is stable with an output capacitor of only 1 ? f and has a maximum output current of 300ma. typical application part number output* voltage (v) package junction temp. range tc1269-2.5vua 2.5 8-pin msop -40c to +125c tc1269-2.8vua 2.8 8-pin msop -40c to +125c tc1269-3.0vua 3.0 8-pin msop -40c to +125c tc1269-3.3vua 3.3 8-pin msop -40c to +125c tc1269-5.0vua 5.0 8-pin msop -40c to +125c 8-pin msop v in shdn bypass v out nc nc gnd nc tc1269 1 2 3 45 6 7 8 tc1269 1 2 3 4 6 7 8 v out v out c bypass 470pf (optional) shutdown control (from power control logic) c1 1 f nc nc gnd bypass v in v in nc shdn + 300ma cmos ldo with shutdown and v ref bypass
tc1269 ds21380c-page 2 ? 2002-2012 microchip technology inc. 1.0 electrical characteristics absolute maximum ratings* input voltage .........................................................6.5v output voltage.................... (v ss ? 0.3) to (v in + 0.3v) maximum voltage on any pin ........v in +0.3v to -0.3v power dissipation................internally limited (note 6) operating temperature ............... -40c < t j < +125c storage temperature..........................-65c to +150c *stresses above those listed under "absolute maximum ratings" may cause permanent damage to the device. these are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. tc1269 electrical specifications electrical characteristics: v in = v out + 1v, i l = 0.1 ? a, c l = 3.3 ? f, shdn > v ih , t a = 25c, unless otherwise noted. boldface type specifications apply for junction temperatures of -40c to +125c. symbol parameter min typ max units test conditions v in input operating voltage ? ? 6.0 v i out max maximum output current 300 ??ma v out output voltage ? v r ? 2.5% v r 0.5% ? ? v r + 2.5% v note 1 ? v out / ? tv out temperature coefficient ? 40 ? ppm/c note 2 ? v out / ? v in line regulation ? 0.05 0.35 %(v r + 1v) ?? v in ??? 6v ? v out /v out load regulation ? 0.5 2.0 %i l = 0.1ma to i out max v in -v out dropout voltage ? ? ? 20 80 240 30 160 480 mv i l = 0.1ma i l = 100ma i l = 300ma (note 4) i ss1 supply current ? 50 90 ? a shdn = v ih i ss2 shutdown supply current ? 0.05 0.5 ? a shdn = 0v psrr power supply rejection ratio ? 50 ? db f re ?? 120hz i outsc output short circuit current ? 550 650 ma v out = 0v ? v out / ? p d thermal regulation ? 0.04 ? v/w note 5 en output noise ? 260 ? nv/ ? hz f = 1khz, c out = 1 ? f, r load = 50 ? shdn input v ih shdn input high threshold 45 ??%v in v il shdn input low threshold ? ? 15 %v in note 1: v r is the regulator output voltage setting. 2: 3: regulation is measured at a constant j unction temperature using low duty cycle pulse testing. load regulation is tested over a load range from 0.1ma to the maximum specified output current. changes in output voltage due to heating effects are covered by the thermal regu lation specifica- tion. 4: dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value mea sured at a 1v differen- tial. 5: thermal regulation is defined as the change in output voltage at a time t after a change in power dissipation is applied, exclu ding load or line regulation effects. specifications are for a current pulse equal to i l max at v in = 6v for t = 10 msec. 6: the maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and th e thermal resistance from junction-to-air (i.e., t a , t j , ? ja ). exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. please see section 4.0 thermal considerations for more details. t c v out = (v out max ? v out min ) x 10 6 v out x ? t
? 2002-2012 microchip technology inc. ds21380c-page 3 tc1269 2.0 pin descriptions the descriptions of the pins are listed in table 2-1. table 2-1: pin function table pin no. (8-pin soic) symbol description 1v out regulated voltage output. 2 nc no connect. 3 nc no connect. 4 gnd ground terminal. 5 bypass reference bypass input. connecting a 470pf to this input further reduces output noise. 6 nc no connect. 7 shdn shutdown control input. the regulator is fully enabled when a logic high is applied to this input. the regulator is fully enabled when a logic high is applied to this input. the regulator enters shut- down when a logic low is applied to this input. during shutdown, output voltage falls to zero and supply current is reduced to 0.05 ? a (typical). 8v in unregulated supply input.
tc1269 ds21380c-page 4 ? 2002-2012 microchip technology inc. 3.0 detailed description the tc1269 is a precision regulator available in fixed voltages. unlike the bipolar regulators, the tc1269 supply current does not increase with load current. in addition, v out remains stable and within regulation over the entire 0ma to i out max operating load current range, (an important consideration in rtc and cmos ram battery backup applications). figure 3-1 shows a typical application circuit. the regulator is enabled any time the shutdown input (shdn ) is at or above v ih , and shutdown (disabled) when shdn is at or below v il . shdn may be controlled by a cmos logic gate, or i/o port of a microcontroller. if the shdn input is not required, it should be connected directly to the input supply. while in shutdown, supply current decreases to 0.05 ? a (typical), v out falls to zero. figure 3-1: typical application circuit 3.1 bypass input a 470pf capacitor connected from the bypass input to ground reduces noise present on the internal reference, which in turn significantly reduces output noise. if output noise is not a concern, this input may be left unconnected. larger capacitor values may be used, but results in a longer time period to rated output voltage when power is initially applied. 3.2 output capacitor a 1 ? f (min) capacitor from v out to ground is recommended. the output capacitor should have an effective series resistance greater than 0.1 ? and less than 5.0 ? , and a resonant frequency above 1mhz. a 1 ? f capacitor should be connected from v in to gnd if there is more than 10 inches of wire between the regulator and the ac filter capacitor, or if a battery is used as the power source. aluminum electrolytic or tantalum capacitor types can be used. (since many aluminum electrolytic capacitors freeze at approxi- mately -30c, solid tantalums are recommended for applications operating below -25c.) when operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques. tc1269 1 2 3 4 6 7 8 nc nc gnd bypass nc shdn battery v out v out c bypass 470pf (optional) shutdown control (from power control logic) c1 1 f v in + c1 1 f + + ?
? 2002-2012 microchip technology inc. ds21380c-page 5 tc1269 4.0 thermal considerations 4.1 thermal shutdown integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 150c. the regulator remains off until the die temperature drops to approximately 140c. 4.2 power dissipation the amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. the following equation is used to calculate worst case actual power dissipation: equation 4-1: the maximum allowable power dissipation (equation 4-2) is a function of the maximum ambient temperature (t a max ), the maximum allowable die temperature (t j max ) and the thermal resistance from junction-to-air ( ? ja ). equation 4-2: equation 4-1 can be used in conjunction with equation 4-2 to ensure regulator thermal operation is within limits. for example: given: v in max = 3.0v 10% v out min = 2.7v ? 2.5% i load = 250ma t a max = 55c find: 1. actual power dissipation 2. maximum allowable dissipation actual power dissipation: p d ? (v in max ? v out min ) i load max = [(3.0 x 1.1) ? (2.7 x .975)]250 x 10 -3 = 167mw maximum allowable power dissipation: in this example, the tc1269 dissipates a maximum of 167mw; below the allowable limit of 350mw. in a similar manner, equation 4-1 and equation 4-2 can be used to calculate maximum current and/or input voltage limits. 4.3 layout considerations the primary path of heat conduction out of the package is via the package leads. therefore, layouts having a ground plane, wide traces at the pads, and wide power supply bus lines combine to lower ? ja and, therefore, increase the maximum allowable power dissipation limit. where: p d ? (v in max ? v out min )i load max p d v in max v out min i load max = worst case actual power dissipation = minimum regulator output voltage = maximum output (load) current = maximum voltage on v in p d max = (t j max ? t a max ) ? ja where all terms are previously defined. p d max = (t j max ? t a max ) ? ja = (125 ? 55) 200 = 350mw
tc1269 ds21380c-page 6 ? 2002-2012 microchip technology inc. 5.0 typical characteristics note: the graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. the performance characteristics listed herein are not tested or guaranteed. in some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. output noise frequency (khz) noise ( v/ hz) 10.0 1.0 0.01 0.01 1 10 100 1000 0.1 0.0 r load = 50 c out = 1 f 0.012 0.010 0.008 0.004 0.002 0.000 -0.002 -0.004 0.006 -40 -20 0 20 40 60 80 100 120 temperature ( c) line regulation line regulation (%) 2.00 1.80 1.60 1.20 1.00 0.80 0.60 0.40 0.20 0.00 1.40 -40 -20 0 20 40 60 80 100 120 temperature ( c) load regulation load regulation (%) 1 to 300ma 1 to 50ma 1 to 100ma 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 0 50 100 150 200 250 300 load current (ma) dropout voltage (v) 100.0 90.0 70.0 80.0 50.0 40.0 60.0 -40 -20 0 20 40 60 80 100 120 temperature ( c) supply current supply current ( a) 3.075 3.025 2.925 2.975 -40 -20 0 20 40 60 80 100 120 temperature ( c) v out vs. temperature v out (v) 12 5 a c load = 3.3 f
? 2002-2012 microchip technology inc. ds21380c-page 7 tc1269 6.0 packaging information 6.1 package marking information package marking data not available at this time. 6.2 taping form 6.3 package dimensions component taping orientation for 8-pin msop devices package carrier width (w) pitch (p) part per full reel reel size 8-pin msop 12 mm 8 mm 2500 13 in carrier tape, number of components per reel and reel size pin 1 user direction of feed standard reel component orientation for tr suffix device w p 8-pin msop .122 (3.10) .114 (2.90) .122 (3.10) .114 (2.90) .043 (1.10) max. .006 (0.15) .002 (0.05) .016 (0.40) .010 (0.25) .197 (5.00) .189 (4.80) .008 (0.20) .005 (0.13) .028 (0.70) .016 (0.40) 6 max. .026 (0.65) typ. pin 1 dimensions: inches (mm) note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging
tc1269 ds21380c-page 8 ? 2002-2012 microchip technology inc. 7.0 revision history revision c (november 2012) added a note to each package outline drawing.
? 2002-2012 microchip technology inc. ds21380c-page9 tc1269 sales and support data sheets products supported by a preliminary data sheet may have an e rrata sheet describing minor operational differences and recom- mended workarounds. to determine if an erra ta sheet exists for a particular device, please contact one of the following: 1. your local microchip sales office 2. the microchip worldwide site (www.microchip.com) please specify which device, revision of silicon and data sheet (include literature #) you are using. new customer notification system register on our web site (www.microchip.com/cn) to receive the most current information on our products.
tc1269 ds21380c-page10 ? 2002-2012 microchip technology inc. notes:
? 2002-2012 microchip technology inc. ds21380c-page 11 information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safety applications is entirely at the buyer?s risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting from such use. no licenses are conveyed, implicitly or otherwise, under any microchip intellectual property rights. trademarks the microchip name and logo, the microchip logo, dspic, flashflex, k ee l oq , k ee l oq logo, mplab, pic, picmicro, picstart, pic 32 logo, rfpic, sst, sst logo, superflash and uni/o are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. filterlab, hampshire, hi-tech c, linear active thermistor, mtp, seeval and the embedded control solutions company are registered trademarks of microchip technology incorporated in the u.s.a. silicon storage technology is a registered trademark of microchip technology inc. in other countries. analog-for-the-digital age, app lication maestro, bodycom, chipkit, chipkit logo, codeguard, dspicdem, dspicdem.net, dspicworks, dsspeak, ecan, economonitor, fansense, hi-tide, in-circuit serial programming, icsp, mindi, miwi, mpasm, mpf, mplab certified logo, mplib, mplink, mtouch, omniscient code generation, picc, picc-18, picdem, picdem.net, pickit, pictail, real ice, rflab, select mode, sqi, serial quad i/o, total endurance, tsharc, uniwindriver, wiperlock, zena and z-scale are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of microchip technology incorporated in the u.s.a. gestic and ulpp are registered trademarks of microchip technology germany ii gmbh & co. & kg, a subsidiary of microchip technology inc., in other countries. all other trademarks mentioned herein are property of their respective companies. ? 2002-2012, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. isbn: 9781620767825 note the following details of the code protection feature on microchip devices: ? microchip products meet the specification cont ained in their particular microchip data sheet. ? microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions. ? there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip produc ts in a manner outside the operating specif ications contained in microchip?s data sheets. most likely, the person doing so is engaged in theft of intellectual property. ? microchip is willing to work with the customer who is concerned about the integrity of their code. ? neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are co mmitted to continuously improvin g the code protection features of our products. attempts to break microchip?s code protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona; gresham, oregon and design centers in california and india. the company?s quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microperipherals, nonvolatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified. quality management s ystem certified by dnv == iso/ts 16949 ==
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